Datasheet

Package Mechanical Specifications
48 Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
3.1.6 Processor Mass Specification
The typical mass of the processor is 35 grams. This mass [weight] includes all the
components that are included in the package.
3.1.7 Processor Materials
Table 3-3 lists some of the package components and associated materials.
3.1.8 Processor Markings
Figure 3-4 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
3.1.9 Processor Land Coordinates
Please refer to Figure 3-3 which shows the bottom view of the processor land
coordinates. The coordinates are referred to throughout the document to identify
processor lands.
§
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 3-4. Processor Top-Side Markings
GRP1LINE1
GRP1LINE2
G2L1
G2L2
G3L1
G3L2
Legend: Mark Text (Engineering Mark):
GRP1LINE1: INTEL{M}{C}’YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES XXXXX
GRP1LINE4: FORECAST-NAME
GRP1LINE5: {FPO} {e4}
Legend: Mark Text (Production Mark):
GRP1LINE1: INTEL{M}{C}’YY PROC#
GRP1LINE2: SUB-BRAND
GRP1LINE3: SSPEC XXXXX
GRP1LINE4: SPEED/CACHE/INTC
GRP1LINE5: {FPO} {e4}