Datasheet

Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1 43
Package Mechanical Specifications
3 Package Mechanical
Specifications
3.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the Processors and Socket in the Intel® Xeon® Processor 5500 Series Thermal /
Mechanical Design Guide (TMDG) for complete details on the LGA1366 socket.
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA1366 Socket
System Board
Capacitors
TIM
IHS
Substrate
LGA
System Board
Capacitors
Die
TIM