Datasheet

4 Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
6.3.3 Multi-Domain Commands.......................................................................125
6.3.4 Client Responses ..................................................................................125
6.3.5 Originator Responses ............................................................................126
6.3.6 Temperature Data ................................................................................127
6.3.7 Client Management...............................................................................128
7Features................................................................................................................131
7.1 Power-On Configuration (POC)...........................................................................131
7.2 Clock Control and Low Power States...................................................................132
7.2.1 Thread and Core Power State Descriptions ...............................................133
7.2.2 Package Power State Descriptions...........................................................134
7.2.3 Intel® Xeon® Processor 5500 Series C-State Power Specifications..............135
7.3 Sleep States ...................................................................................................136
7.4 Intel
®
Turbo Boost Technology..........................................................................136
7.5 Enhanced Intel SpeedStep
®
Technology .............................................................136
8 Boxed Processor Specifications..............................................................................137
8.1 Introduction....................................................................................................137
8.1.1 Available Boxed Thermal Solution Configurations ......................................137
8.1.2 An Intel “Combo” Boxed Passive / Active Combination Heat Sink Solution.....137
8.1.3 Intel Boxed “Active” Heat Sink Solution ...................................................138
8.1.4 Intel Boxed 25.5mm Tall Passive Heat Sink Solution..................................139
8.2 Mechanical Specifications..................................................................................140
8.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........140
8.2.2 Boxed Processor Retention Mechanism and Heat Sink
Support (URS)......................................................................................149
8.3 Fan Power Supply (“Combo” and “Active” Solution) ..............................................150
8.3.1 Boxed Processor Cooling Requirements....................................................151
8.4 Boxed Processor Contents.................................................................................153