Datasheet

Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1 3
Contents
1Introduction..............................................................................................................9
1.1 Terminology .....................................................................................................10
1.2 References .......................................................................................................12
2 Intel® Xeon® Processors 5500 Series Electrical Specifications ...............................13
2.1 Processor Signaling ...........................................................................................13
2.1.1 Intel QuickPath Interconnect....................................................................13
2.1.2 DDR3 Signal Groups ...............................................................................13
2.1.3 Platform Environmental Control Interface (PECI) ........................................14
2.1.4 Processor Sideband Signals .....................................................................14
2.1.5 System Reference Clock..........................................................................14
2.1.6 Test Access Port (TAP) Signals.................................................................15
2.1.7 Power / Other Signals.............................................................................15
2.1.8 Reserved or Unused Signals.....................................................................23
2.2 Signal Group Summary......................................................................................23
2.3 Mixing Processors..............................................................................................25
2.4 Flexible Motherboard Guidelines (FMB).................................................................26
2.5 Absolute Maximum and Minimum Ratings.............................................................26
2.6 Processor DC Specifications ................................................................................28
2.6.1 VCC Overshoot Specifications...................................................................31
2.6.2 Die Voltage Validation.............................................................................32
3 Package Mechanical Specifications ..........................................................................43
3.1 Package Mechanical Specifications.......................................................................43
3.1.1 Package Mechanical Drawing....................................................................44
3.1.2 Processor Component Keep-Out Zones......................................................47
3.1.3 Package Loading Specifications ................................................................47
3.1.4 Package Handling Guidelines....................................................................47
3.1.5 Package Insertion Specifications...............................................................47
3.1.6 Processor Mass Specification....................................................................48
3.1.7 Processor Materials.................................................................................48
3.1.8 Processor Markings.................................................................................48
3.1.9 Processor Land Coordinates.....................................................................48
4Land Listing.............................................................................................................49
4.1 Intel® Xeon® Processors 5500 Series Pin Assignments..........................................49
4.1.1 Land Listing by Land Name......................................................................49
4.1.2 Land Listing by Land Number...................................................................67
5 Signal Definitions ....................................................................................................85
5.1 Signal Definitions ..............................................................................................85
6 Thermal Specifications ............................................................................................89
6.1 Package Thermal Specifications...........................................................................89
6.1.1 Thermal Specifications............................................................................89
6.1.2 Thermal Metrology ............................................................................... 103
6.2 Processor Thermal Features.............................................................................. 104
6.2.1 Processor Temperature ......................................................................... 104
6.2.2 Adaptive Thermal Monitor...................................................................... 104
6.2.3 On-Demand Mode ................................................................................ 106
6.2.4 PROCHOT# Signal................................................................................ 106
6.2.5 THERMTRIP# Signal ............................................................................. 107
6.3 Platform Environment Control Interface (PECI).................................................... 107
6.3.1 PECI Client Capabilities ......................................................................... 108
6.3.2 Client Command Suite .......................................................................... 109