Datasheet

85
Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in Section 2.13.
2. Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on silicon characterization.
4. Power specifications are defined at all VIDs found in Table 2-12. The Quad-Core Intel® Xeon® Processor
E5400 Series may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-5. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B Table
Power (W) T
CASE_MAX
(°C)
0 43.5
5 44.6
10 45.7
15 46.8
20 47.9
25 49.0
30 50.1
35 51.2
40 52.3
45 53.4
50 54.6
55 55.7
60 56.8
65 57.9
70 59.0
75 60.1
80 61.2
85 62.3
90 63.4
95 64.5
100 65.6
105 66.7
110 67.8
115 68.9
120 70.0
Table 6-6. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 80 5 See Figure 6-3; Table 6-7 1, 2, 3, 4, 5