Datasheet

4 Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
6.2.1 Intel
®
Thermal Monitor Features...............................................................90
6.2.2 On-Demand Mode...................................................................................92
6.2.3 PROCHOT# Signal ..................................................................................93
6.2.4 FORCEPR# Signal ...................................................................................93
6.2.5 THERMTRIP# Signal................................................................................94
6.3 Platform Environment Control Interface (PECI) ......................................................94
6.3.1 Introduction...........................................................................................94
6.3.2 PECI Specifications .................................................................................96
7Features..................................................................................................................97
7.1 Power-On Configuration Options ..........................................................................97
7.2 Clock Control and Low Power States.....................................................................97
7.2.1 Normal State .........................................................................................98
7.2.2 HALT or Extended HALT State...................................................................98
7.2.3 Stop-Grant State..................................................................................100
7.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State.........................................................................101
7.3 Enhanced Intel SpeedStep® Technology.............................................................101
8 Boxed Processor Specifications..............................................................................103
8.1 Introduction....................................................................................................103
8.2 Mechanical Specifications..................................................................................105
8.2.1 Boxed Processor Heat Sink Dimensions (CEK)...........................................105
8.2.2 Boxed Processor Heat Sink Weight..........................................................113
8.2.3 Boxed Processor Retention Mechanism and Heat Sink
Support (CEK)......................................................................................113
8.3 Electrical Requirements ....................................................................................113
8.3.1 Fan Power Supply (Active CEK)...............................................................113
8.3.2 Boxed Processor Cooling Requirements....................................................114
8.4 Boxed Processor Contents.................................................................................115
9 Debug Tools Specifications ....................................................................................117
9.1 Debug Port System Requirements......................................................................117
9.2 Target System Implementation..........................................................................117
9.2.1 System Implementation.........................................................................117
9.3 Logic Analyzer Interface (LAI) ...........................................................................117
9.3.1 Mechanical Considerations .....................................................................118
9.3.2 Electrical Considerations........................................................................118