Product Info

Table Of Contents

ABLUE TECHNOLOGY

Storage temperature

-40

125

°C

Flash memory Endurance

10000

Write/erase cycles

Note: Exceeding one or more of the limiting values may cause permanent damage to the module.

Notes and Cautions:

Design Notes

(1) It is critical to following the recommendations of this document to ensure the module meets the

specifications.

(2) Power supply must be free of AC ripple voltage. If such noise is present, it is critical to provide proper

filtering and decoupling.

(3) The module should not be stressed mechanically after installation.

(4) Exposing the module to significant temperatures will result in degradation and decreased lifetime.

(5) Keep module away from other high frequency devices which may interfere with operation such as

other transmitters and devices generating high frequencies.

(6) Avoid static electricity, ESD and high voltage as these may damage the module.

Handling and Storage

(1) Keep module away from other high frequency devices which may interfere with operation such as

other transmitters and devices generating high frequencies.

(2) Do not expose the module to the following conditions: Corrosive gasses such as Cl2, H2S, NH3, SO2,

or NOX Extreme humidity or salty air Prolonged exposure to direct Sunlight Temperatures beyond those

specified for storage.

(3) Do not apply mechanical stress.

(4) Do not drop or shock the module.

(5) Avoid static electricity, ESD and high voltage as these may damage the module.

Moisture Sensitivity

All plastic packages absorb moisture. During typical solder reflow operations when SMDs are

mounted onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient

temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in

vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of the

plastic mold compound, then it is possible to crack the package. Even if the package does not crack,

interfacial delamination can occur.

Since the device package is sensitive to moisture absorption, it is recommended to bake the product

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