User's Manual

802.11b/g/n Wireless LAN Daughter board V2.1

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TABLE OF CONTENTSINTRODUCTION

Features ................................................................................................................................... 1

1. EXECUTIVE SUMMARY.................................................................................................... 5

2. BLOCK DIAGRAM ............................................................................................................ 6

3. DELIVERABLES................................................................................................................ 6

4. REFERENCE DOCUMENTS ............................................................................................. 7

5. TECHNICAL SPECIFICATIONS........................................................................................ 8

5.1. ABSOLUTE MAXIMUM RATING............................................................................................ 8

5.2. RECOMMENDABLE OPERATION CONDITION.................................................................... 8

5.2.1. TEMPERATURE, HUMIDITY ......................................................................................... 8

5.2.2. VOLTAGE ...................................................................................................................... 8

5.2.3. POWER CONSUMPTION (SDIO, GSPI MODE) ............................................................ 8

5.3. WIRELESS SPECIFICATIONS.............................................................................................. 9

5.4. RADIO SPECIFICATIONS 802.11B/G/N................................................................................9

5.5. ANTNENNA SPECIFICATIONS ............................................................................................ 9

5.6 THROUGHPUT CONDITION REFERENCE............................... .............................................. 9

.7. REFERENCE EVB CIRCUIT................................................................................................ 10

5.8. TIMING DIAGRAM OF INTEFACE....................................................................................... 14

5.9. DIMENSIONS, WEIGHT AND MOUNTING.......................................................................... 18

5.9.1. DIMENSIONS............................................................................................................... 18

6. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS................................. 18

7. PIN OUT AND PIN DESCRIPTION.................................................................................. 19

8. REFLOW PROFILE GUIDELINE ……………………………………………………………..17

9. PACKAGE AND STORAGE CONDITION .......................................................................... 22

9.1. PACKAGE DIMENSION....................................................................................................... 19

9.2. ESD LEVEL ......................................................................................................................... 20

9.3 MSL Level/Storage condition ................................................................................

.....21

9.4 Recommened MSD baking specification..................................................................................25