User's Manual

802.11b/g/n Wireless LAN Daughter board V2.1
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21
RECOMMENDED REFLOW PROFILE
(1) Solder paste alloy : SAC305 (Sn96.5/Ag3.0/Cu0.5) ( Lead Free solder paste.)
(2) A-B. Temp.: 150~200 ; soak time:60~120sec.(Base on Flux type, reference only) ℃
(3) C. Peak temp: <245 ℃
(4) D. Time above 217 : 40~90sec.(Base on SAC305) ℃
(5) Suggestion: Optimal cooling rate is <1 /sec. from peak to 217 . ℃ ℃
(6) Nine heater zones at least for Reflow equipment.
(7) Nitrogen usage is recommended and be controlled the value less than 1500 ppm.
Note: Need to inspect solder joint by X-ray post reflow.