User's Manual

5
RECOMMENDED REFLOW PROFILE
(1) Solder paste alloy : SAC305 (Sn96.5/Ag3.0/Cu0.5) ( Lead Free solder paste.)
(2) A-B. Temp.: 150~200℃; soak time:60~120sec.(Base on Flux type, reference
only)
(3) C. Peak temp: <245℃
(4) D. Time above 217 ℃: 40~90sec.(Base on SAC305)
(5) Suggestion: Optimal cooling rate is <1℃ /sec. from peak to 217 ℃.
(6) Nine heater zones at least for Reflow equipment.
(7) Nitrogen usage is recommended and be controlled the value less
than 1500 ppm. Note: Need to inspect solder joint by X-ray post reflow.