Data Sheet

© 2006 Microchip Technology Inc. DS21034D-page 21
MCP3202
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
D
e
n
b
2
1
c
L
A
A1
A2
ϕ
β
α
MILLIMETERS*
MIN NOM
MAX
1.20
1.05
0.15
4.50
3.10
0.75
8°
0.20
0.30
8
–
1.00
–
4.40
3.00
0.60
–
–
–
–
0.80
0.05
4.30
2.90
0.45
0°
0.09
0.19
INCHES
MIN NOM
MAX
8
–
.039
–
.173
.118
.024
–
–
–
.047
.041
.006
.177
.122
.030
8°
.008
.012
–
.031
.002
.169
.114
.018
0°
.004
.007
.026 BSC
0.65 BSC
.252 BSC
6.40 BSC
12° REF
12° REF
12° REF
12° REF
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-086 Revised 7-25-06
n
e
A
A2
A1
E
E1
D
L
ϕ
c
b
α
β