Data Sheet

MCP3202
DS21034D-page 20 © 2006 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
L
L1
ϕ
c
A2
A1
A
b
2
1
NOTE 1
e
E
E1
D
N
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Units
Dimension Limits
N
e
A
A2
A1
E
E1
D
L
L1
ϕ
c
b
—
0.75
0.00
0.40
0°
0.08
0.22
8
0.65 BSC
—
0.85
—
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
—
—
—
1.10
0.95
0.15
0.80
8°
0.23
0.40
MIN
NOM MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be
located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–111, Sept. 8, 2006