Data Sheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: DNL vs. Code.
- Figure 2-2: DNL vs. Code and Ambient Temperature.
- Figure 2-3: Absolute DNL vs. Ambient Temperature.
- Figure 2-4: INL vs. Code and Ambient Temperature.
- Figure 2-5: Absolute INL vs. Ambient Temperature.
- Figure 2-6: INL vs. Code.
- Figure 2-7: Full-Scale VOUTA w/G = 1 (VREF) vs. Ambient Temperature and VDD.
- Figure 2-8: Full-Scale VOUTA w/G = 2 (2VREF) vs.Ambient Temperature and VDD.
- Figure 2-9: Output Noise Voltage Density (VREF Noise Density w/G = 1) vs. Frequency.
- Figure 2-10: Output Noise Voltage (VREF Noise Voltage w/G = 1) vs. Bandwidth.
- Figure 2-11: MCP4821 IDD vs. Ambient Temperature and VDD.
- Figure 2-12: MCP4821 IDD Histogram (VDD = 2.7V).
- Figure 2-13: MCP4821 IDD Histogram (VDD = 5.0V).
- Figure 2-14: MCP4822 IDD vs. Ambient Temperature and VDD.
- Figure 2-15: MCP4822 IDD Histogram (VDD = 2.7V).
- Figure 2-16: MCP4822 IDD Histogram (VDD = 5.0V).
- Figure 2-17: Hardware Shutdown Current vs. Ambient Temperature and VDD.
- Figure 2-18: Software Shutdown Current vs. Ambient Temperature and VDD.
- Figure 2-19: Offset Error vs. Ambient Temperature and VDD.
- Figure 2-20: Gain Error vs. Ambient Temperature and VDD.
- Figure 2-21: VIN High Threshold vs. Ambient Temperature and VDD.
- Figure 2-22: VIN Low Threshold vs. Ambient Temperature and VDD.
- Figure 2-23: Input Hysteresis vs. Ambient Temperature and VDD.
- Figure 2-24: VOUT High Limit vs. Ambient Temperature and VDD.
- Figure 2-25: VOUT Low Limit vs. Ambient Temperature and VDD.
- Figure 2-26: IOUT High Short vs. Ambient Temperature and VDD.
- Figure 2-27: IOUT vs. VOUT. Gain = 2.
- Figure 2-28: VOUT Rise Time 100%.
- Figure 2-29: VOUT Fall Time.
- Figure 2-30: VOUT Rise Time 50%.
- Figure 2-31: VOUT Rise Time 25% - 75%.
- Figure 2-32: VOUT Rise Time Exit Shutdown.
- Figure 2-33: PSRR vs. Frequency.
- 3.0 Pin descriptions
- 4.0 General Overview
- 5.0 Serial Interface
- 6.0 Typical Applications
- 6.1 Digital Interface
- 6.2 Power Supply Considerations
- 6.3 Output Noise Considerations
- 6.4 Layout Considerations
- 6.5 Single-Supply Operation
- 6.6 Bipolar Operation
- 6.7 Selectable Gain and Offset Bipolar Voltage Output Using A Dual DAC
- 6.8 Designing A Double-Precision DAC Using A Dual DAC
- 6.9 Building A Programmable Current Source
- 7.0 Development support
- 8.0 Packaging Information
© 2005 Microchip Technology Inc. DS21953A-page 33
MCP4821/4822
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP4821: 12-Bit DAC with SPI™ Interface
MCP4821T: 12-Bit DAC with SPI Interface
(Tape and Reel) (SOIC, MSOP)
MCP4822: 12-Bit DAC with SPI Interface
MCP4822T: 12-Bit DAC with SPI Interface
(Tape and Reel) (SOIC, MSOP)
Temperature Range: E = -40°C to +125°C
Package: MS = Plastic MSOP, 8-lead
P = Plastic DIP (300 mil Body), 8-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
PART NO. X /XX
PackageTemperature
Range
Device
Examples:
a) MCP4821T-E/SN: Tape and Reel
Extended Temperature,
8LD SOIC package.
b) MCP4821T-E/MS: Tape and Reel
Extended Temperature,
8LD MSOP package.
c) MCP4821-E/SN: Extended Temperature,
8LD SOIC package.
d) MCP4821-E/MS: Extended Temperature,
8LD MSOP package.
e) MCP4821-E/P: Extended Temperature,
8LD PDIP package.
a) MCP4822T-E/SN: Tape and Reel
Extended Temperature,
8LD SOIC package.
b) MCP4822-E/P: Extended Temperature,
8LD PDIP package.
c) MCP4822-E/SN: Extended Temperature,
8LD SOIC package.