Data Sheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: DNL vs. Code.
- Figure 2-2: DNL vs. Code and Ambient Temperature.
- Figure 2-3: Absolute DNL vs. Ambient Temperature.
- Figure 2-4: INL vs. Code and Ambient Temperature.
- Figure 2-5: Absolute INL vs. Ambient Temperature.
- Figure 2-6: INL vs. Code.
- Figure 2-7: Full-Scale VOUTA w/G = 1 (VREF) vs. Ambient Temperature and VDD.
- Figure 2-8: Full-Scale VOUTA w/G = 2 (2VREF) vs.Ambient Temperature and VDD.
- Figure 2-9: Output Noise Voltage Density (VREF Noise Density w/G = 1) vs. Frequency.
- Figure 2-10: Output Noise Voltage (VREF Noise Voltage w/G = 1) vs. Bandwidth.
- Figure 2-11: MCP4821 IDD vs. Ambient Temperature and VDD.
- Figure 2-12: MCP4821 IDD Histogram (VDD = 2.7V).
- Figure 2-13: MCP4821 IDD Histogram (VDD = 5.0V).
- Figure 2-14: MCP4822 IDD vs. Ambient Temperature and VDD.
- Figure 2-15: MCP4822 IDD Histogram (VDD = 2.7V).
- Figure 2-16: MCP4822 IDD Histogram (VDD = 5.0V).
- Figure 2-17: Hardware Shutdown Current vs. Ambient Temperature and VDD.
- Figure 2-18: Software Shutdown Current vs. Ambient Temperature and VDD.
- Figure 2-19: Offset Error vs. Ambient Temperature and VDD.
- Figure 2-20: Gain Error vs. Ambient Temperature and VDD.
- Figure 2-21: VIN High Threshold vs. Ambient Temperature and VDD.
- Figure 2-22: VIN Low Threshold vs. Ambient Temperature and VDD.
- Figure 2-23: Input Hysteresis vs. Ambient Temperature and VDD.
- Figure 2-24: VOUT High Limit vs. Ambient Temperature and VDD.
- Figure 2-25: VOUT Low Limit vs. Ambient Temperature and VDD.
- Figure 2-26: IOUT High Short vs. Ambient Temperature and VDD.
- Figure 2-27: IOUT vs. VOUT. Gain = 2.
- Figure 2-28: VOUT Rise Time 100%.
- Figure 2-29: VOUT Fall Time.
- Figure 2-30: VOUT Rise Time 50%.
- Figure 2-31: VOUT Rise Time 25% - 75%.
- Figure 2-32: VOUT Rise Time Exit Shutdown.
- Figure 2-33: PSRR vs. Frequency.
- 3.0 Pin descriptions
- 4.0 General Overview
- 5.0 Serial Interface
- 6.0 Typical Applications
- 6.1 Digital Interface
- 6.2 Power Supply Considerations
- 6.3 Output Noise Considerations
- 6.4 Layout Considerations
- 6.5 Single-Supply Operation
- 6.6 Bipolar Operation
- 6.7 Selectable Gain and Offset Bipolar Voltage Output Using A Dual DAC
- 6.8 Designing A Double-Precision DAC Using A Dual DAC
- 6.9 Building A Programmable Current Source
- 7.0 Development support
- 8.0 Packaging Information
MCP4821/MCP4822
DS21953A-page 28 © 2005 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
5°
5° -
-
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15°5° -
15°5° -
JEDEC Equivalent: MO-187
0° - 8°
5°
5° -
-
15°
15°
--
-
-