Data Sheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Typical Performance Curves
- Figure 2-1: DNL vs. Code.
- Figure 2-2: DNL vs. Code and Ambient Temperature.
- Figure 2-3: Absolute DNL vs. Ambient Temperature.
- Figure 2-4: INL vs. Code and Ambient Temperature.
- Figure 2-5: Absolute INL vs. Ambient Temperature.
- Figure 2-6: INL vs. Code.
- Figure 2-7: Full-Scale VOUTA w/G = 1 (VREF) vs. Ambient Temperature and VDD.
- Figure 2-8: Full-Scale VOUTA w/G = 2 (2VREF) vs.Ambient Temperature and VDD.
- Figure 2-9: Output Noise Voltage Density (VREF Noise Density w/G = 1) vs. Frequency.
- Figure 2-10: Output Noise Voltage (VREF Noise Voltage w/G = 1) vs. Bandwidth.
- Figure 2-11: MCP4821 IDD vs. Ambient Temperature and VDD.
- Figure 2-12: MCP4821 IDD Histogram (VDD = 2.7V).
- Figure 2-13: MCP4821 IDD Histogram (VDD = 5.0V).
- Figure 2-14: MCP4822 IDD vs. Ambient Temperature and VDD.
- Figure 2-15: MCP4822 IDD Histogram (VDD = 2.7V).
- Figure 2-16: MCP4822 IDD Histogram (VDD = 5.0V).
- Figure 2-17: Hardware Shutdown Current vs. Ambient Temperature and VDD.
- Figure 2-18: Software Shutdown Current vs. Ambient Temperature and VDD.
- Figure 2-19: Offset Error vs. Ambient Temperature and VDD.
- Figure 2-20: Gain Error vs. Ambient Temperature and VDD.
- Figure 2-21: VIN High Threshold vs. Ambient Temperature and VDD.
- Figure 2-22: VIN Low Threshold vs. Ambient Temperature and VDD.
- Figure 2-23: Input Hysteresis vs. Ambient Temperature and VDD.
- Figure 2-24: VOUT High Limit vs. Ambient Temperature and VDD.
- Figure 2-25: VOUT Low Limit vs. Ambient Temperature and VDD.
- Figure 2-26: IOUT High Short vs. Ambient Temperature and VDD.
- Figure 2-27: IOUT vs. VOUT. Gain = 2.
- Figure 2-28: VOUT Rise Time 100%.
- Figure 2-29: VOUT Fall Time.
- Figure 2-30: VOUT Rise Time 50%.
- Figure 2-31: VOUT Rise Time 25% - 75%.
- Figure 2-32: VOUT Rise Time Exit Shutdown.
- Figure 2-33: PSRR vs. Frequency.
- 3.0 Pin descriptions
- 4.0 General Overview
- 5.0 Serial Interface
- 6.0 Typical Applications
- 6.1 Digital Interface
- 6.2 Power Supply Considerations
- 6.3 Output Noise Considerations
- 6.4 Layout Considerations
- 6.5 Single-Supply Operation
- 6.6 Bipolar Operation
- 6.7 Selectable Gain and Offset Bipolar Voltage Output Using A Dual DAC
- 6.8 Designing A Double-Precision DAC Using A Dual DAC
- 6.9 Building A Programmable Current Source
- 7.0 Development support
- 8.0 Packaging Information
MCP4821/MCP4822
DS21953A-page 2 © 2005 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
DD
............................................................................................................. 6.5V
All inputs and outputs ...................AV
SS
– 0.3V to V
DD
+ 0.3V
Current at Input Pins ....................................................±2 mA
Current at Supply Pins ...............................................±50 mA
Current at Output Pins ...............................................±25 mA
Storage temperature .....................................-65°C to +150°C
Ambient temp. with power applied ................-55°C to +125°C
ESD protection on all pins ........... ≥ 4 kV (HBM), ≥ 400V (MM)
Maximum Junction Temperature (T
J
)..........................+150°C
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
5V AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
DD
= 5V, AV
SS
= 0V, V
REF
= 2.048V, output buffer gain (G) = 2x,
R
L
= 5 kΩ to GND, C
L
= 100 pF, T
A
= -40 to +85°C. Typical values at +25°C.
Parameters Sym Min Typ Max Units Conditions
Power Requirements
Input Voltage V
DD
2.7 — 5.5
Input Current - MCP4821
Input Current - MCP4822
I
DD
—
—
330
415
400
750
µA Digital inputs grounded, Output
unloaded, code = 0x000
Hardware Shutdown Current I
SHDN
—0.3 2 µA
Software Shutdown Current I
SHDN_SW
—3.3 6 µA
Power-on-Reset Threshold V
POR
—2.0 — V
DC Accuracy
Resolution n 12 — — Bits
INL Error INL -12 2 12 LSb
DNL
(Note 1) DNL -0.75 ±0.2 +0.75 LSb Device is monotonic
Offset Error V
OS
-1 ±0.02 1 % of FSR Code = 0x000h
Offset Error Temperature
Coefficient
V
OS
/°C — 0.16 — ppm/°C -45°C to 25°C
— -0.44 — ppm/°C +25°C to 85°C
Gain Error g
E
-2 -0.10 2 % of FSR Code 0xFFFh, not including offset
error
Gain Error Temperature
Coefficient
ΔG/°C — -3 — ppm/°C
Internal Voltage Reference (V
REF
)
Nominal Reference Voltage V
REF
2.008 2.048 2.088 V V
OUTA
when G = 1x and
Code = 0xFFFh
Temperature Coefficient
(Note 1)
ΔV
REF
/°C — 125 325 ppm/°C -40°C to 0°C
— 0.25 0.65 LSb/°C -40°C to 0°C
— 45 160 ppm/°C 0°C to +85°C
— 0.09 0.32 LSb/°C 0°C to +85°C
Output Noise (V
REF
Noise) E
NREF
(0.1-10 Hz)
— 290 — µV
p-p
Code = 0xFFFh, G = 1
Output Noise Density e
NREF
(1 kHz)
—1.2 —µV/
√
Hz Code = 0xFFFh, G = 1
e
NREF
(10 kHz)
—1.0 —µV/
√
Hz Code = 0xFFFh, G = 1
1/f Corner Frequency f
CORNER
— 400 — Hz
Note 1: By design, not production tested.
2: Too small to quantify.