Brochure

58
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
AMERICA
USA Tel: [phone] email: [e-mail]
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5130, 5131, 5132, 5133 Extruded heat sink with radial fins
Extruded heat sink with radial fins
feature equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220,TO-218, and TO-247 devices.
(0.500)
12.70
(0.125)
3.18
(1.375)
34.92
(0.062)
1.57
(1.000)
25.40
2x
(0.156)
3.96
2x
(0.093)
2.37
"A"
"B"
"C"
ø
17.48
(0.688)
"D"
"E"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0
400
200 600 800
1000
51310X
51300X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0
400
200 600 800
1000
51330X
51320X
Mounting Surface Temp
Rise Above Ambient—°C
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim “C” Dim “D” Dim “E” Dim
513001B02500G TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513002B02500G TO-220 25.40 (1.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513101B02500G TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513102B02500G TO-220 38.10 (1.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513201B02500G TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513202B02500G TO-220 50.80 (2.000) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
513301B02500G TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 3.66 (0.144) 17.02 (0.670) 13.72 (0.540) 2.67 (0.105)
513302B02500G TO-220 63.50 (2.500) 18.29 (0.720) 3.17 (0.125) 15.88 (0.625) 11.10 (0.437) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
BW38, BW50, BW63 Wide extruded heat sink with unequal channel
Wide extruded heat sink with
unequal channel widths on front
and back can accommodate a TO-220,
TO-218, or TO-247 device. Includes two
solderable mounting pins which permit
vertical mounting and eliminate stress
on device leads. Available in three heights.
Versions without hole use clip 6801 (sold
separately) to attach device. See page 97
for clip information.
25.40
(1.000)
4.00
(0.157)
2.60
(0.101)
25.40
(1.000)
21.60
(0.850)
2.00
(0.079)
3.6
(0.144)
"A"
ø
34.90
(1.375)
12.70
(0.500)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
048121620
8
6
2
4
0
0
400
200 600 800
1000
BW50
BW63
BW38
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description “A” Dim Holes
BW38-2G Extruded heat sink with unequal channel widths front and back 38.00 (1.496) No 3.00 (0.118)
BW38-4G With device mounting hole 38.00 (1.496) Yes 3.00 (0.118)
BW50-2G Extruded heat sink with unequal channel widths front and back 50.00 (1.968) No 3.00 (0.118)
BW50-4G With device mounting hole 50.00 (1.968) Yes 3.00 (0.118)
BW63-2G Extruded heat sink with unequal channel widths front and back 63.00 (2.480) No 3.00 (0.118)
BW63-4G With device mounting hole 63.00 (2.480) Yes 3.00 (0.118)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99