Brochure

55
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
AMERICA
USA Tel: [phone] email: [e-mail]
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
Extruded heat sink with radial
fins and clip attach feature
makes device attachment easy.
Includes two solderable mounting
pins which permit vertical mount-
ing and eliminate stress on device
leads. Available in four heights for
TO-220,TO-218 and TO-247 devices.
39.10
(1.540)
6.60
(0.260)
13.50
(0.530)
25.40
(1.000)
2x
2.36
(0.093)
2x3.96
(0.156)
3.18
(0.125)
0.64
(0.025)
"A"
"B"
NOTCH
FOR CLIP
2x
34.92
(1.375)
12.70
(0.500)
DITTIN
HIGH
ø
X
"C"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0
400
200 600 800
1000
53310X
53300X
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim “C” Dim
533001B02551G TO-218,TO-247 25.40 (1.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533002B02551G TO-220 25.40 (1.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533101B02551G TO-218,TO-247 38.10 (1.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533102B02551G TO-220 38.10 (1.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533201B02551G TO-218,TO-247 50.80 (2.000) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533202B02551G TO-220 50.80 (2.000) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
533301B02551G TO-218,TO-247 63.50 (2.500) 21.59 (0.850) 17.02 (0.670) 2.67 (0.105)
533302B02551G TO-220 63.50 (2.500) 18.29 (0.720) 15.88 (0.625) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
02 4 6 810
8
6
2
4
0
0
400
200 600 800
1000
53330X
53320X
Mounting Surface Temp
Rise Above Ambient—°C
For additional options see page 83
CLIP 51
5304 High rise style heat sink features staggered fins and Wave-On
TM
solderable mounts
High rise style heat sink features
staggered fins and Wave-On
TM
solderable mounts for easy attach-
ment to the PC card. Models include
thru holes on one side to attach
devices using standard hardware
and dittins with special slots on the
other for easy device attachment
using a convenient spring clip.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
0 4 8 12 16 20
4
3
1
2
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
Part Number Description Device “A” Dim
530401B00100G High rise style heat sink staggered fins TO-218,TO-247 21.08 (0.830) 4.75 (0.187)
530401B00150G With device clip #50 TO-218,TO-247 21.08 (0.830) 4.75 (0.187)
530402B00100G High rise style heat sink staggered fins TO-220 18.29 (0.720) 4.75 (0.187)
530402B00150G With device clip #50 TO-220 18.29 (0.720) 4.75 (0.187)
ORDERING INFORMATION
24.13
(0.950)
44.45
(1.750)
ø
3.20
(0.126)
THRU
7.49
(0.295)
"A"
2.54
(0.100)
12.45
(0.490)
19.05
(0.750)
2.79
(0.110)
0.76
(0.030)
44.45
(1.750)
x
HIGH
ø
7.62
(0.300)
10.16
(0.400)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
1.57
(0.060)
2.54
(0.100)
DITTIN
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
CLIP 50
For additional options see page 82
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99