Brochure

46
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
AMERICA
USA Tel: [phone] email: [e-mail]
www.aavidthermalloy.com
ORDERING INFORMATION
5751, 5793, 5794 Snap down style heat sink featuring two side fins
Snap down style heat sink features
two side fins that act as springs
to hold the semiconductor firmly
to the heat sink. Models include an
integrated clip and device locking
catch for more robust applications.
Available for both standard and
bevel edged TO-220 packages.
Part Number Description Figure
575102B00000G Snap down heat sink A
579302B00000G With integrated clip and locking catch B
579402B00000G With integrated clip and locking catch B
for TO-220 with beveled edge
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
01 2 3 4 5
8
6
2
4
0
0
400
200 600 800
1000
579302
Mounting Surface Temp
Rise Above Ambient—°C
579402
TO-220 Heat Sinks
19.05
(0.750)
12.32
(0.485)
14.22
(0.560)
3.81
(0.150)
28.45
(1.120)
THRU
ø
11.18
(0.440)
11.18
(0.440)
11.18
(0.440)
"A"
"A"
579302
19.05
(0.750)
24.89
(0.980)
579402
3.15
(0.124)
LOCKING CATCH
View A-A View A-A
ø
FIGURE A
FIGURE B
Material: 0.63 (0.025) Thick Aluminum
Finish: Black Anodize
For additional options see page 82
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
20
0
20
40
60
80
100
01 2 3 4 5
16
12
4
8
0
0
400
200 600 800
1000
575102
Mounting Surface Temp
Rise Above Ambient—°C