Brochure

12
HEAT SINKS FOR IC PACKAGES
EUROPE
ASIA
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
AMERICA
USA Tel: [phone] email: [e-mail]
www.aavidthermalloy.com
ORDERING INFORMATION
Solder anchor attachment
Aavid's unique Solder anchor attachment method
uses two or four small Solder anchors attached to
the circuit card and a wire spring clip to securely
fasten the heat sink to the device.This method is
rugged, compact and allows for easy removal in
case of rework.
All products include a phase change pad suitable
for most IC package styles to optimize thermal
performance. Models are available with a single
or dual spring clips for additional thermal interface
pressure. Solder anchors are ordered separately.
IC Pkg Size (mm) IC Pkg Style Part Number “W” (mm) “L” (mm) “H” (mm) “A”(mm)
θ
n
1
θ
f
2
Finish Fig.
4
PCB Fig.
4
#Anchors
3
23 x 23 All 374024B60023G 23.00 23.00 10.00 49.70 40.00 11.69 Black anodize 1 A 2
23 x 23 All 374124B60023G 23.00 23.00 18.00 49.70 23.40 7.39 Black anodize 1 A 2
23 x 23 All 374224B60023G 23.00 23.00 25.00 49.70 19.70 6.37 Black anodize 1 A 2
27 x 27 All 374324B60023G 27.00 27.00 10.00 49.70 30.60 9.35 Black anodize 1 A 2
27 x 27 All 374424B60023G 27.00 27.00 18.00 49.70 20.30 6.46 Black anodize 1 A 2
27 x 27 All 374524B60023G 27.00 27.00 25.00 49.70 16.50 5.47 Black anodize 1 A 2
35 x 35 Flip chip 10-5634-01G 31.00 34.90 23.00 11.50 4.20 Black anodize 2 C 2
35 x 35 Flip chip 10-THMA-01G 31.00 34.90 35.00 10.70 3.95 Black anodize 2 C 2
35 x 35 All 374624B60024G 35.00 35.00 10.00 62.30 23.40 7.55 Black anodize 1 B 2
35 x 35 All 374724B60024G 35.00 35.00 18.00 62.30 15.30 5.15 Black anodize 1 B 2
35 x 35 All 374824B60024G 35.00 35.00 25.00 62.30 12.00 4.27 Black anodize 1 B 2
37.5 x 37.5 Flip chip 10-BRD2-01G 35.70 37.30 23.00 11.50 4.20 Clear anodize 2 B 2
37.5 x 37.5 Flip chip 10-BRD1-01G 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2
37.5 x 37.5 Flip chip 10-BRD1-03G 37.50 37.50 23.00 10.10 3.83 Black anodize 3 D 4
37.5 x 37.5 Flip chip 10-BRD1-04G 37.50 37.50 23.00 10.10 3.83 Black anodize 2 B 2
37.5 x 37.5 Flip chip 10-BRD1-05G 37.50 37.50 23.00 10.10 3.83 Clear anodize 3 D 4
37.5 x 37.5 Flip chip 10-BRD1-07G 37.50 37.50 23.00 10.10 3.83 Clear anodize 2 B 2
40 x 40 All 374924B60024G 40.00 40.00 10.00 62.30 20.30 6.46 Black anodize 1 B 2
40 x 40 All 375024B60024G 40.00 40.00 18.00 62.30 12.20 4.34 Black anodize 1 B 2
42 x 40 All 375124B60024G 40.00 40.00 25.00 62.30 10.30 3.83 Black anodize 1 B 2
42.5 x 42.5 Flip chip 10-CLS1-01G 42.30 42.30 23.00 8.80 3.51 Black anodize 2 E 2
42.5 x 42.5 Flip chip 10-CLS2-01G 42.30 42.30 35.00 8.30 3.44 Black anodize 2 E 2
BGA–Solder Anchor
1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.
2. Force convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
3. Solder anchors are sold separately refer to drawing above.
4. Solder anchor mechanical drawings and board mounting drawings see page 13.
7.19
(0.283)
7.62
(0.300)
5.08
(0.200)
0.64
(0.025)
"A"
2.49
(0.098)
SOLDER ANCHOR
Part Number PCB Thickness (mm) “A”Dim (mm)
125700D00000G 1.60 3.61
125800D00000G 2.54-2.79 4.70