Brochure

87
INTERFACE MATERIALS
EUROPE
ASIA
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AMERICA
USA Tel: [phone] email: [e-mail]
www.aavidthermalloy.com
Alignment Pads
Aavid Thermalloy has added a phase change
pad to its line-up.These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
Interface Material/Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Suffix Device Figure
8223-CL03G TO-220 B
8241-CL11G TO-218 A
Hi-Flow®*
(1.000)
25.40
(0.030)
0.76
(0.122)
3.10
(0.985)
25.02
(0.520)
13.21
(1.200)
30.48
(0.860)
21.84
9.40
(0.370)
5.08
(0.200)
3.25
(0.128)
1
CLIP ASSEMBLY
C
L
(0.460)
11.68
(0.300)
7.62
(0.670)
17.02
0.51
(0.020)
TYP
THK
14.22
(0.560)
3.18
(0.125)
0.76
(0.030)
(0.860)
21.84
5.08
(0.200)
(0.790)
20.07
Figure A
ORDERING INFORMATION
example
Thermalloy origin part
7022B–8223–CL03 G
A
B
A = Model number
B = Alignment pad
C = RoHS compliant
Figure B
Typical installation
Shown with part number 8241-CL11
Recommended hole pattern for 8223-CL03G Recommended hole pattern for 8241-CL11G
14.73
(0.580)
7.37
(0.290)
2.54
(0.100)
2.54
(0.100)
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.95
(0.116)
DIA PLATED
THRU HOLE
25.40
(1.000)
12.70
(0.500)
5.46
(0.215)
2.95
(0.116)
DIA PLATED
THRU HOLE
5.46
(0.215)
1.60
(0.063)
DIA PLATED
THRU HOLE
TYP(3)
TYP(2)
C
Reinforcement carrier Polymide
Thickness 0.127 (0.005)
Continuous use temp (°C) 150
Phase change temp(°C) 55
Dielectric breakdown voltage (Vac) 5000
Dielectric constant (1000 Hz) 4.5
Volume resistivity (Ohm-meter) 1012
MATERIAL PROPERTIES
(1.650)
41.91
(1.140)
28.96
2X
(0.093)
2.36
2X
(0.140)
3.56
ø
ø
21.84
(0.860)
18.80
(0.740)
2.69
(0.160)
16.76
(0.660)
DIA
19.05
(0.750)
12.70
(0.500)
3.73
(0.147)
14.30
(0.563)
DIA
TO-3
TO-220
TO-218
530101B _ 5150G
Ordering code
ORDERING INFORMATION
example 12 digit part
Ordering code Description
0 No pads
7 One Hi-Flow® pad
8 Two Hi-Flow® pads
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used.To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Thermal impedance vs. pressure
Pressure 10 25 50 200
TO-220 Thermal performance (ºC/W) 1.15 1.14 1.12 1.1
* Hi-Flow® is a registered trademark of the Bergquist Company