Brochure
61
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
EUROPE
ASIA
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AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
6374 Extruded heat sink for SIP packages
Extruded heat sink for SIP
packages. Solderable pins
allow vertical mounting
without stress on the device
leads. Can also be used for
dual TO-220,TO-218,TO-247,
and multiwatt devices.
3.96
(0.156)
2.18
(0.086)
31.75
(1.250)
38.10
(1.500)
2.92
(0.115)
17.50
(0.689)
32.00
(1.260)
16.00
(0.630)
8.00
(0.315)
DETAIL A
SEE DETAIL A
24.38
(0.960)
59.99
(2.362)
17.78
(0.700)
3.81
(0.150)
ø
2X
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
0
20
40
60
80
100
02 4 6 810
4
3
1
2
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
6374BG Extruded heat sink with solderable pins 2.89 (0.114)
Dia of PCB
Plated Thru
Hole for Pins
YB32-4 High power flat back extruded channel style heat sink
High power flat back extruded channel
style heat sink features a wide channel
to accommodate several devices. Includes
two solderable pins to allow vertical
mounting without stress on the device
leads. Can be used with TO-220, TO-218,
TO-247, and multiwatt devices.
2X
3.00
(0.118)
19.00
(0.748)
4.00
(0.157)
38.30
(1.508)
Ø 3.10
(0.122)
THRU
16.00
(0.630)
32.00
(1.260)
4.70
(0.185)
60.00
(2.362)
2X
32.00
(1.260)
8.00
(0.315)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
0 2 4 6 8 10
8
6
2
4
0
0
400
200 600 800
1000
Mounting Surface Temp
Rise Above Ambient—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Description
YB32-4G High power flat back extruded heat sink 3.48 (0.137)
TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks
5810, 5811, 5812 Flat back extruded heat sink featuring solderable pins
Flat back extruded heat sink features
solderable pins which allow vertical
mounting without stess on the device
leads. Available in three heights for
TO-220 and TO-218 devices.
10.29
(0.405)
TYP 2
2.36
(0.093)
3.96
(0.156)
8.13
(0.320)
16.26
(0.640)
"A"
16.26
(0.640)
3.45
(0.136)
#6 - 32 UNC THRU
"B"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
10
0
20
40
60
80
100
012 345
8
6
2
4
0
0
400
200 600 800
1000
58110X
58100X
Mounting Surface Temp
Rise Above Ambient—°C
58120X
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number Device “A” Dim “B” Dim
581001B02500G TO-218 25.40 (1.000) 21.59 (0.850) 2.67 (0.105)
581002B02500G TO-220 25.40 (1.000) 18.29 (0.720) 2.67 (0.105)
581101B02500G TO-218 38.10 (1.500) 21.59 (0.850) 2.67 (0.105)
581102B02500G TO-220 38.10 (1.500) 18.29 (0.720) 2.67 (0.105)
581201B02500G TO-218 50.80 (2.000) 21.59 (0.850) 2.67 (0.105)
581202B02500G TO-220 50.80 (2.000) 18.29 (0.720) 2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
For additional options see page 85
For additional options see page 83
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Dia of PCB
Plated Thru
Hole for Pins