Instruction manual

Chapter 1 General Information 5
Power management: I/O peripheral devices support power saving and
doze/standby/suspend modes. APM 1.2 compliant
H/W status monitoring: Winbond W83781D H/W status monitoring IC
supportspower supply voltages, fan speed, and temperatures monitoring
Flat Panel/CRT Interface
Chipset: NS CS5530
Display memory: Shared UMA up to 4MB
Display type: Supports non-interlaced CRT and up to 18-bit TFT LCD
displays. Can display both CRT and flat panel simultaneously
Resolution: Up to 1024x768 @ 64K colors (CRT/LCD simultaneous
display)
LVDS Interface (Optional)
Chipset: Thine THC63LVDM63A
Transmitting capability: 18-bit panel signal over 10 meters cable
Audio Interface
Chipset: NS CS5530
3D audioSupports: Microsoft DirectSound and DirectSound 3D audio
technology in two-speaker mode (requires Microsoft Direct
Sound 3D supported software titles)
16-bit stereo digital audio: Full-duplex supports enables simultaneous
record and playback for Internet communications software