User Manual

Module Specification
NO. AT2530
TITLE:
Module, ZigBee, 14.9 x 21.9 x 2.65mm, 45 I/O, Edge Castellated, SMD
REVISION DATE: 22 May 2013 ISSUE: O PAGE: 13 of 19
4.0 Assembly Information
4.1 Lead-Free soldering reflow profile
Condition
Exposure
Average ramp
-
up
rate
(200
°C to 250°C)
< 3
°C / second
> 217
°C
60
-
120 seconds
Peak temperature
250
+0/
-
5
°C
Time within 5
°C of peak
20
-
30 seconds
Ramp
-
down rate (Peak to 50
°C)
Less than 6
°C / second
Table 8: Reflow Profile Recommendation
5.0 Reliability Tests
No. Test item Test condition
1 Reflow Thermal Cycle Normal Pbfree reflow Condition 2 times
2 Thermal Shock Cycle
30min. at -40 °C , 30min. at 85 °C , 100Cycles
Recovery Time 1hours
3 Vibration Test
JESD22
-
B103
-
B Service Condition 5,
5Hz -> 500Hz, Acceleration 0.3g, 4min/Cycle.
Total 4 cycles per axis
4 High Temperature Storage Test 96 hours at 85 °C , Recovery Time 1hours
5 Low Temperature Storage Test 96 hours at -40 °C , Recovery Time 1hours
6
High Temperature & Humidity
Storage Test
96 hours at 60 °C & 90%RH±2%RH.
Recovery Time 1hours
7 Drop Test
Height min 76 ㎝ , All sides onto metal plate
Table 9: Reliability Tests