Owner's manual
A P Products GmbH A P Products Ltd. A P Products S.r.l.
Bäumlesweg 21 – 23 80 Cromwell Road Viale Abruzzi, 87
71093 Weil im Schönbuch Saffron Walden, CB11 4BE 20131 Milano
Germany Great Britain Italia
Tel: +49-7157-5348-0 Tel: +44-1799-526602 Tel: +39-02-29404697
Fax: +49-7157-5348-39 Fax: +44-1799-521408 Fax: +39-02-29523280
Web: www.ap-products.de Web: www.ap-products.co.uk Web: www.ap-products.it
E-mail: info@ap-products.de E-mail: info@ap-products.co.uk E-mail: info@ap-products.it
29/11/2007 16.07.00
Reflow Soldering Information
All Components should be soldered according to
IPC/JEDEC J-STD-020C temperature-profile
for leadfree reflow-soldering (maximum values):
A P Products GmbH
High Temperature Headers
So
lder Profile
Profile Feature Pb-Free assembly
Average Ramp-Up Rate (Ts
max
to T
p
) 3 °C / second max.
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (ts
min
to ts
max
)
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
217°C
60-150 seconds
Peak/Classification Temperature (T
p
) 260°C +/- 5°C
Time within 5°C of actual Peak
Temperature (t
p
)
10-15 seconds
Ramp-Down Rate 6°C / second max.
Time 25°C to Peak Temperature 8 minutes max.
Engineering Note:
The informa
tion presented in this
datasheet is accurate to the best of
our knowledge.
Due to ongoing efforts to advance
design and material performance,
this information is subject to change
without notice.