Datasheet

ManualsBrands3M ManualsAdhesiveEpoxy thermal Compound and Adhesive, 2-Component 37 ml

™

Thermally Conductive Epoxy Adhesive TC-2810

Product Description

3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a thermally conductive 2-part epoxy using boron nitride (BN)

ﬁller for good thermal conductivity with high adhesion.

Technical Data August 2014

Features and Benefits

• High adhesive strength

• Slight tack allows pre-assembly

• Good surface wet out

• Low viscosity for potting application

• Good gap ﬁlling

• Thin bonding line

• Good thermal conductivity (1.0-1.4 W/m-K)

• Low Cl ion content and outgassing

Typical Uncured Properties

Note: The following technical information and data should be considered representative or typical only, and should not

be used for specification purposes.

Product 3M™ Thermally Conductive Epoxy Adhesive TC-2810

Viscosity Base 40,000 - 90,000 cps

Accelerator 11,000 - 21,000 cps

Mixed 40,000 - 80,000 cps initial

Base Resin Base Epoxy

Accelerator Amine

Filler Boron Nitride 24% by weight

Mix Ratio (B:A) Volume 2:1

Worklife 60 minutes at 23°C (72°F)

Net Weight Base 10.84

(lb/gal) Accelerator 10.28

Mixed 10.63

Summary of content (6 pages)

PAGE 1
Technical Data August 2014 3M™ Thermally Conductive Epoxy Adhesive TC-2810 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion. Features and Benefits • High adhesive strength • Slight tack allows pre-assembly • Good surface wet out • Low viscosity for potting application • Good gap filling • Thin bonding line • Good thermal conductivity (1.0-1.
PAGE 2
3M™ Thermally Conductive Epoxy Adhesive TC-2810 Typical Cured Properties Note: T he following technical information and data should be considered representative or typical only, and should not be used for specification purposes. Product 3M™ Thermally Conductive Epoxy Adhesive TC-2810 Color Cream Glass Transition Temperature See Chart on page 3 -6 Thermal Coefficient of Expansion 62 x 10-6/°C (below Tg) 205 x 10 /°C (above Tg) Thermal Conductivity* 0.80 - 1.4 W/m-°K Thermal Impedance** 0.
PAGE 3
M™ Thermally Conductive Epoxy Adhesive TC-2810 Curing Cure Schedule: 23°C / 24 hours 50°C / 270 minutes 70°C / 90 minutes 90°C / 30 minutes 120°C / 10 minutes Note: The following technical information and data should be considered representative or typical only, and should not be used for specification purposes. Shear Strength, Peel Strength, Tg vs.
PAGE 4
3M™ Thermally Conductive Epoxy Adhesive TC-2810 Curing (continued) 3M™ Thermally Conductive Epoxy Adhesive TC-2810 – Strength Build Up vs Time 15 minutes vs 30 minutes (65°C cure) 3500 3313.08 3000 2894.12 2877.12 3073.4 3084.84 30 15 3274.4 3003.56 2856.91 2683.56 2575.
PAGE 5
3M™ Thermally Conductive Epoxy Adhesive TC-2810 Application and Product Use Notes For bonding rigid to rigid parts it is suggested that the bond line thickness and edge fillet be designed to optimize: i) Bond Strength; ii) Thermal Resistance. A typical suggested bond line is in the 3-7 mil thickness range For improved thermal performance (lower Thermal Resistance), a thinner bond line is suggested.
PAGE 6
3M™ Thermally Conductive Epoxy Adhesive TC-2810 Storage and Shelf Life The shelf life of 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is 12 months from the date of manufacture when stored in original cartons at 21°C (70°F) and 50% relative humidity. Safety Data Sheet Consult Safety Data Sheet before use. Regulatory For regulatory information about this product, contact your 3M representative.