3 Scotch-Weld™ Hot Melt Bonding Systems Design, Assembly and Packaging Reference Guide Systems approach to help you improve productivity and lower costs.
Speed and versatility for many applications 3M™ Scotch-Weld™ Hot Melt Adhesives and Applicators are advanced hand-held systems to help you improve productivity, lower cost, and minimize waste. Adhesives are 100% solids thermoplastic resins that become fluid when heated and quickly wet the bonding surface. They cool, harden, and reach bond strength in seconds. You can move assemblies immediately to keep production flowing. This helps eliminate clamps, fixturing and drying, and saves time, energy, and space.
Selecting a 3M™ Scotch-Weld™ Hot-Melt Applicator to fit your needs B A 3M™ Scotch-Weld™ Hot Melt Applicator LT 10 E 3M™ Scotch-Weld™ Hot Melt Applicator LT with Quadrack™ Converter 11 3M™ Scotch-Weld™ Hot Melt Applicator TC 14 12 3M™ Scotch-Weld™ Hot Melt Applicator TC with Quadrack™ Converter G F 3M™ Scotch-Weld™ Hot Melt Applicator AE II D C 3M™ Scotch-Weld™ Hot Melt Applicator EC 15 13 H 3M™ Scotch-Weld™ Hot Melt Applicator PG II LT with Speedloader 16 3M™ Scotch-Weld™ Hot Melt Appl
Low Melt Technology: Bulk Hot Melt Technology: Applied 350°–385°F (177°–196°C) Applied 250°–270°F (127°–132°C) Product Information: 3M™ Scotch-Weld™ Hot Melt Adhesives Sizes EC Temp Control Modules Flash Point (°F/°C) • “Delayed-tack” applied in thin-glue-line ribbon for bonding paper, corrugated, chipboard, P.O.P.
Delivery Time (sec) for 1'' x 3'' Cartridge** Ball & Ring Soft Point(3) (°F/°C) Heat Resistance (°F/°C) Impact Resistance (in.-lbs.
Accessories to improve your productivity Tip No. 9913 9916 9917 9921 9922 9940 9946 9725 9726 9727 9729 9785 9777 9782 9764 9726 9913 9727 9764 9782 9916 9729 9777 9785 9946 9917 9922 9921 9940 9725 Description 2 Hole Spreader (1/4" hole span) 3 Hole Spreader 3 Hole 1" Spreader for Scotch-Weld™ Applicator II only .090" Fluted Tip .063" Fluted Tip .125" Fluted Tip .072" Brass Extension for Scotch-Weld™ Applicator II only Mini Extension Tip .
