Datasheet

3M
™
Scotch-Weld
™
Epoxy Potting Compound/Adhesive
DP270 Clear and Black
- 6 -
Application and
Equipment Suggestions
These products may be applied by spatula, trowel or flow equipment.
Two part mixing/proportioning/dispensing equipment is available for intermittent or
production line use. These systems are ideal because of their variable shot size and
flow rate characteristics and are adaptable to most applications.
Handling/Curing
Information (continued)
3. For maximum bond strength apply product evenly to both surfaces to be joined.
4. Application to the substrates should be made within 70 minutes. Larger quantities
and/or higher temperatures will reduce this working time.
5. Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until
firm. Heat up to 200°F (93°C) will speed curing.
6. The following times and temperatures will result in a full cure of these products.
23°C (73°F) 48 Hours
50°C (122°F) 4 Hours
80°C (176°F) 60 Minutes
100°C (212°F) 30 Minutes
7. Keep parts from moving during cure. Contact pressure necessary. Maximum shear
strength is obtained with a 3-5 mil bond line.
8. Excess uncured adhesive can be cleaned up with ketone type solvents*.
*Note: When using solvents, extinguish all ignition sources, including pilot lights,
and follow the manufacturer’s precautions and directions for use.
Adhesion Coverage: A 0.005 in. thick bondline will yield a coverage of
320 sq. ft./gallon