Datasheet
3
Scotch-Weld
TM
Epoxy Potting Compound/Adhesive
DP270 Clear and Black
Product Description
3M
TM
Scotch-Weld
TM
Epoxy Potting Compound/Adhesive DP270 (or 3M™ Scotch-
Weld™ Epoxy Potting Compound/Adhesive 270 B/A) is a two-part, low viscosity
epoxy resin system designed primarily for potting, sealing, and encapsulation of
many electronic components and is available in clear or black. Scotch-Weld epoxy
potting compound/adhesive DP270 is noncorrosive to copper and offers good
thermal shock resistance and excellent retention of electrical insulation properties
under high humidity conditions.
Scotch-Weld epoxy potting compound/adhesive DP270 has a work life of
approximately 70 minutes, a tack-free time of about 3 hours and is fully cured after
48 hours at 73°F (23°C). This product produces no exotherm in 5-10 gram masses
and a very slight exotherm in larger masses.
Scotch-Weld epoxy potting compound/adhesive DP270 is ideal for the potting and
encapsulation of many heat sensitive or delicate components such as glass diodes
and sensors as well as for transformers, coils, chokes, relays, etc. It is available in
the convenient 3M™ EPX™ Applicator System for multi-station usage and in bulk
containers for larger volume applications.
Available in bulk containers as Scotch-Weld epoxy potting compound/adhesive
270 B/A.
Features
• Good Thermal Shock Resistance • Excellent Electrical Properties
• Meets UL 94 HB (File No. E61941) • Noncorrosive to Copper
• Long Worklife • Negligible Exotherm
Technical Data December, 2009
Typical Uncured
Properties
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
Color: Clear or Black
Base Resin: Epoxy/amine
Mix Ratio: 1:1 by volume (1:0.85 B:A by weight)
Net Weight: Base 9.6 - 9.8
Lbs./Gal. Accelerator 8.0 - 8.2
Worklife: 60-70 minutes @ 23°C (73°F)
Viscosity: Base 7000 - 16,000 cps
@ 23°C (73°F) Accelerator 6000 - 12,000 cps